Designers are creating Printed Circuit Boards (PCBs) with higher density, higher power and smaller than ever before. Thermal analysis is necessary to keep up with these advances. To realize and solve potential problems in the design phase and avoid costly overdesign or failure due to thermal issues, thermal analyses must be performed.
Sintecs has been the reliable partner for thermal analyses of electronic systems. Our thermal experts combine the deep knowledge of heat transfer and thermodynamics with sophisticated usage of the thermal analysis software. This combination ensures accuracy and innovation in the thermal management of the most complicated electronic project.
Thermal analyses activities
Sintecs provides answers for the entire scope of thermal activities for all phases of your project serving as one source for execution and implementation of all thermal tasks.
We perform the thermal analysis/simulation to estimate temperature rise in different parts of the product and to identify possible impairment of reliability caused by excessive heat.
The thermal analyses focuses on:
- Identifying points of weakness in thermal/mechanical design (hot spots)
- Looking for zones of stagnation (low cooling efficiency).
- Identifying overstressed components (junction temperature exceeding established value)
Thermal analyses serve as an input to mechanical and electrical design improvements, reliability prediction and stress analyses
Our thermal analyses experts will ensure that your thermal requirements are answered from the very beginning of a project. We offer cost effective solution for design and optimization of electronic cooling systems.
Thermal modeling is the most reliable way for decision-making during design. Thermal modeling answers questions about airflow and temperature distribution, size and number of the fans, influence of the configuration changes and failures of fans. Sintecs thermal management experts use the world leading Flomerics software for the full 3-dimensional simulation of convective, conductive, and radiative heat transfer characteristics of your system's critical components.
By using high-speed design, analyses and verification techniques early in the design cycle, designers can eliminate layout iterations and ensure that products are marketed on time.