The success (and failure) of electronic designs depends on whether the desired voltages and currents are met from source to destination on the circuit board and in the entire system.

For high speed boards, the influence of switching signals on power rails becomes larger and this leads to more electromagnetic interference. In addition, the voltage ripple at chip pads needs to be kept within boundaries as well as the SSO (simultaneous switching output), power and ground bounce.

Power aware simulation and power integrity analysis is key to prevent PCB respins.

 

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